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硅片拋光機的應用概述

作者:liu 發表時間:2012-07-09 人氣:

平面拋光機拋光(che而  caiMechanicalPolishing,簡稱CMp)作為集成電路(IntegratedCircult,簡稱lC)制造的核心技術被廣泛應用于集成電路制造過程中硅片表面的局部和全局平坦化加工。硅片拋光機是一個非常復雜的過程,影響平面拋光機拋光過程的因素有很多,而加工區域中拋光液的動態壓力和溫度變化是影響表面非均勻性和材料去除率的關鍵因素之一。在集成電路制造中,采用的硅片尺寸不斷增大,器件特征尺寸不斷縮小,硅片拋光機拋光加工區域中拋光液動態壓力和溫度變化對硅片表面質量的影響越來越突出。目前,對IC制造中硅片CMP加工區域中拋光液動態壓力和溫度研究還不系統和完善,深入研究硅片·CMP加工區域中拋光液動態壓力和溫度變化對最終實現高質量、超精密、無損傷加工表面有著非常重要的意義。  

(l)genjurunhualilun、shenliulilunheweijiliutililun,duidachicunguipiancmpjiagongguochengzhonghanmolipaoguangyedeliudongxingjinxingleyanjiu,jianlilepaoguangyeliudongdesanweimoxing。yanjiulepaoguangyezhongxuanfunamijimolidechicun、nongdu,paoguangdiandeduokongxixingneng、houduhebiaomiancucaodu,guipiandechicunhequlv,guipianhepaoguangdiandezhuansudengguanjianyinsuduipaoguangyeliudongdeyingxiang,liutiyalifenbudeshiyanjieguoyulilunmonidejieguojibenyizhi。

(2)genjuhuaxuejixiepaoguangdetedian,tongguoduixianyoushiyanshebeijinxinggaizao,jianlileguipianpaoguangjipaoguangshiyantai。gaishiyantaishixianlepaoguangtoudezhudongxuanzhuangongneng,paoguangtoudewanxiangfudonggongneng;paoguangzaihejiazaijidiaojiegongneng,yijipaoguangyeshusongjiliuliangkongzhigongneng。weijinxinghuaxuejixiepaoguangniuju、paoguangyali、mocaliyijijiagongquyuzhongpaoguangyedongtaiyalihewenduceliangdengyanjiutigonglejichudeshiyanpingtai。

(3)genjuliutiyaliceliangdejibenyuanli,duiguipianpaoguangjipaoguangjiagongquyuzhongpaoguangyedongtaiyaliceliangfangfajinxingyanjiu,tichuleduodianyuanweishishiceliangjiagongquyuzhongpaoguangyedongtaiyalidefangfa。zaicijichushang,duiguipianpaoguangjipaoguangjiagongquyuzhongpaoguangyeliutiyaliceliangxitongjinxingleyanjiu,jianlileguipiancmpjiagongquyuzhongpaoguangyedongtaiyalishishijiancexitong,xitongwuchaxiaoyushi0.25%,manzupaoguangyedongtaiyaliceshideyaoqiu。

(4)zaicmpshiyantaifeng,yunyongsuojianlidepaoguangyedongtaiyaliceliangxitong,jinxingguipianpaoguangjipaoguangjiagong.quyuzhongpaoguangyeliutidongtaiyaliceliangshiyan,yanjiulepaoguangyalihexiangduisududuiguipianpaoguangjipaoguangjiagongquyuzhongpaoguangyeliutidongtaiyalideyingxiang,jieguobiaoming:zaipaoguangyalijiaoxiaodeqingkuangguipianpaoguangjipaoguangjiagongquyuzhongpaoguangyedongyahewenduyanjiuxia,guipianyupaoguangdianzhijianpaoguangyerongyixingchengrunhuachengzaimo,paoguangyedongtaiyalisuizhupaoguangyalidezengjiaerzengda;lingyifangmian,zaixiangtonggongkuangtiaojianxia,guipianyupaoguangdianzhijiandexiangduisuduzengjiashi,guipianyupaoguangdianzhijianpaoguangyechanshengdeliutidongtaiyaliyezengda。

(5)genjuwenduceliangdejibenyuanli,shenrufenxileyingxiangguipiancmpjiagongquyuzhongpaoguangyewenduceliangdegezhongyinsu,tichulejiyujiechufadeduodianyuanweishishiceliangguipianpaoguangjipaoguangjiagongquyuzhongpaoguangyewendudefangfa。zaicijichushang,jinxingleguipiancmpjiagongguochengzhongpaoguangyewenduceliangxitongyanjiu,jianlileguipianpaoguangjipaoguangjiagongquyuzhongpaoguangyewenduceliangxitong,jinxinglepaoguangyewenduceliangdewuchafenxi,bingzaiceliangzhongcaiquyixieduiyingcuoshi,paichuganrao,jianxiaolewucha,shiceliangxitongwuchaxiaoyutu0.47%。

(6)運用所建立的拋光液溫度測量系統,進行了硅片拋光機拋光加工區域中拋光液溫度測量實驗研究,結果表明拋光壓力、相對速度和拋光墊的摩擦系數等因素對加工區域拋光液溫度變化具有決定性的影響.